Advancing Precision and Control in EM Micro Target Preparation

Andrew Lawson

Product Performance Manager, Leica Microsystems

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Andrew Lawson, Product Performance Manager at Leica Microsystems since 2016, supports EM sample preparation solutions. With an M.S. in Materials Science and Engineering from the University of Maryland, he specializes in imaging and elemental analysis for materials science, semiconductors, and polymers, with a focus on nanofabrication and plasmonic materials.

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Seth Villarreal

Advanced Workflow Specialist, Leica Microsystems

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Seth Villarreal is an Advanced Workflow Specialist at Leica Microsystems, supporting EM sample prep across cryo and room temperature workflows. He provides hands-on and virtual training for electron microscopy applications. Seth holds an Ph.D. from Case Western Reserve University and completed a fellowship at NIH/NINDS, focusing on cryoTEM and TEM research in cell biology.

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Mercedeh Yeganeh

Advanced Workflow Specialist, Leica Microsystems

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Mercedeh is an Advanced Workflow Specialist at Leica Microsystems with a strong background in cryo-EM, TEM, and materials science. She supports diverse workflows across EM/SEM sample prep, ultramicrotomy, and confocal microscopy. Known for her collaborative approach and problem-solving skills, Mercedeh combines technical expertise with business insight gained through the Harvard Business School Online CORe program.

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Learn how advanced EM preparation technologies are transforming micro target location, alignment, and preparation—turning complex and error-prone workflows into fast, precise, and reliable processes.

In this webinar, you will learn how to:

• Mechanically prepare micro targets using a mechanical cross-sectioning device (EM TXP), demonstrated live on a real sample
• Produce pristine surfaces through broad ion beam milling with the EM TIC 3X system
• Pre-prepare your samples more efficiently, reducing ion milling time through synergic use of the TXP-TIC 3X workflow

Preparing micro targets in microelectronics and other advanced materials systems presents a major challenge because these targets are rarely visible. As a result, pinpointing and aligning them precisely can be difficult, making preparation to the exact target a time-consuming and error-prone process where the target may easily be missed. In addition, specimens containing micro targets are typically small, fragile, and difficult to handle, further complicating the workflow.

Advanced preparation systems now make it possible to achieve precise, real-time control of micro target preparation and surface quality. The EM TXP device enables accurate in situ mechanical preparation through an integrated viewing system that enables every stage of the process to be monitored. When combined with the EM TIC 3X broad ion beam milling system, you can produce pristine, artifact-free surfaces ready for high-resolution EM analysis.

Developed by Leica Microsystems, this integrated workflow significantly simplifies the preparation of even the most challenging micro targets, saving time while improving reliability and surface quality.